Resumen
This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.
Informaciones generales
-
Estado: PublicadoFecha de publicación: 2021-10Etapa: Norma Internacional publicada [60.60]
-
Edición: 2Número de páginas: 9
-
Comité Técnico :ISO/TC 172/SC 9ICS :31.260
- RSS actualizaciones
Ciclo de vida
-
Anteriormente
RetiradaISO 14881:2001
-
Ahora