Resumen
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
Informaciones generales
-
Estado: PublicadoFecha de publicación: 2023-01Etapa: Norma Internacional publicada [60.60]
-
Edición: 1Número de páginas: 12
-
Comité Técnico :ISO/TC 206ICS :81.060.30
- RSS actualizaciones