Abstract
This document specifies a test method for plasma resistance of ceramic components in semiconductor manufacturing equipment. It is applicable to ceramic components of plasma-resistant components in dry etching chambers used in semiconductor manufacturing.
General information
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Status: PublishedPublication date: 2019-06Stage: Close of review [90.60]
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Edition: 1Number of pages: 4
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Technical Committee :ISO/TC 206ICS :81.060.30
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